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Home > Products&Services > Semiconductor Process Equipmen > High Temperature Oxidation Annealing Furnace

High temperature annealing furnace (2200)

Equipment characteristics：

◆Adapt to various specifications and sizes of process chips: small square chips, irregular and 2, 4, and 6 inch wafers

◆Optimize structural design with small footprint

◆Flexible and diverse process adjustments

◆Extremely convenient for operation, use, and maintenance

◆Extremely high precision indicators and reliability

 Supporting process：

◆Adapt to various specifications and sizes of process chips: small square chips, irregular and 2, 4, and 6 inch wafers

◆The process temperature can reach 2200 ℃ (the furnace body can reach a higher temperature)

◆Small batch R& D is 5 pieces/furnace, production type is 50 pieces/furnace

◆Normal pressure/pressure control, limit ＜ 10-3mbar, process pressure: 1-250mbar

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