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8 "Oxidized LPCVD Furnace (Production Type)

Performance：

◆Vertical structure, efficient production capacity, 150 pieces/batch

 ◆Stable and excellent film-forming uniformity, with good repeatability

 ◆Advanced Technology for Low Oxygen Control in Microenvironments

 ◆Stable control of silicon wafer particle size, international standard

 ◆Fully automated process, box to box, 21 box storage

 ◆High integration, complete factory MES system integration

 ◆Complies with standards such as SECS II/HSMS/GEM

Supporting process：

◆Oxidize：Dry oxygen/wet oxygen（DCE, HCL）

 ◆Nitrogen and hydrogen annealing (rapid thermal annealing), sintering, alloying, curing, etc

 ◆LPCVD Technology：Polycrystalline silicon, silicon nitride, silicon oxide (PSG, BPSG, etc.), TEOS, LTO/HTO, SIPOS, etc.


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