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Home > Products&Services > Semiconductor Process Equipmen > High Temperature Oxidation Annealing Furnace

High temperature oxidation furnace (1500)

Equipment characteristics： 

 ◆Adapt to various specifications and sizes of process chips: small square chips, irregular and 2, 4, and 6 inch wafers

 ◆Optimize structural design with small footprint

 ◆Flexible and diverse process adjustments

 ◆Extremely convenient for operation, use, and maintenance

 ◆Extremely high precision indicators and reliability

 Performance： 

 ◆The process temperature can reach 1350/1500 ℃ (the furnace body can reach higher temperatures)

 ◆Small batch R& D is 5 pieces/furnace, production type is 50 pieces/furnace

 ◆Manual loading and unloading/fully automatic box to box loading and unloading（Cassette to Cassette）

 ◆Atmospheric/vacuum pressure control, limit< 10-3mbar, process pressure：800～1000mbar

 ◆Furnace structure：horizontal/vertical


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